Electronic device case, method and mold for manufacturing the same, and mobile communications terminal

ABSTRACT

An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2009-0035635 filed on Apr. 23, 2009, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic device case, a method andmold for manufacturing the same, and a mobile communications terminal,and more particularly, to an electronic device case having a radiatorsuch that an antenna radiator is embedded in an electronic device case,a method and mold for manufacturing the same, and a mobilecommunications terminal.

2. Description of the Related Art

Mobile communications terminals such as cellular phones, personaldigital assistants (PDAs) and laptop computers, which support wirelesscommunications, are indispensable devices in modern society. Functionsincluding CDMA, wireless LANs, GSM and DMB have been added to thesemobile communications terminals. One of the most important componentsthat enable these functions is associated with antennas.

Antennas being used in these mobile communications terminals haveadvanced from external antennas, such as rod antennas or helicalantennas, to internal antennas that are disposed inside terminals.

External antennas are susceptible to damage by external shock, whileinternal antennas increase the volume of terminals.

In order to solve these problems, research has been undertaken tomanufacture antennas that are formed integrally with mobilecommunications terminals.

In order that antennas are formed integrally with terminals, a method ofbonding flexible antennas to terminal bodies using adhesives is used.Recently, a method of forming antenna films by molding has beenproposed.

However, when flexible antennas are bonded by simply using adhesives,the reliability of these antennas is reduced as the adhesivenessdecreases. Besides, this also causes harm to the appearance of theterminals, lessening emotional quality for consumers.

In addition, when antenna films are used, product stability can beensured. However, a process of bonding an antenna to a film is difficultto perform and manufacturing costs are also increased.

SUMMARY OF THE INVENTION

An aspect of the present invention provides an electronic device casehaving an antenna radiator embedded therein.

An aspect of the present invention also provides a method and mold formanufacturing an electronic device case having an antenna radiatorembedded therein.

According to an aspect of the present invention, there is provided anelectronic device case having an antenna pattern embedded therein, theelectronic case including: a radiator having an antenna pattern portiontransmitting and receiving a signal and a connection terminal portionallowing the signal to be transmitted to and received from a circuitboard of an electronic device; a connection portion partially formingthe radiator and connecting the antenna pattern portion and theconnection terminal portion to be arranged in different planes; aradiator frame manufactured by injection molding on the radiator so thatthe antenna pattern portion of the radiator is provided on one side ofthe radiator frame and the connection terminal portion is provided onthe other side thereof; and a case frame covering the one side of theradiator frame on which the antenna pattern portion is provided so thatthe antenna pattern portion is embedded between the case frame and theradiator frame.

The case frame may be an injection molded part and have a recesscorresponding to the one side of the radiator frame.

The case frame may be manufactured using injection molding on theradiator frame.

The radiator may be bent to provide the connection terminal portion, theantenna pattern portion, and the connection portion connectedtherebetween.

The connection terminal portion may be supported by a radiator supportportion on the other side of the radiator frame.

The connection terminal portion may be provided through the radiatorsupport portion on the other side of the radiator frame.

The radiator frame, the case frame, or the radiator frame and the caseframe may have a curved portion so that the radiator has a curvature.

According to another aspect of the present invention, there is providedan electronic device case having an antenna pattern embedded therein,the electronic case including: a radiator having an antenna patternportion transmitting and receiving a signal; a connection terminalseparated from the antenna pattern portion and having a connectionterminal portion allowing the signal of the antenna pattern portion tobe transmitted to or received from a circuit board of an electronicdevice; an antenna pattern frame manufactured by injection molding sothat the antenna pattern portion is provided on one side of the antennapattern portion, the connection terminal portion is provided on theother side thereof, and the radiator makes contact with the connectionterminal; and a case frame covering the one side of the antenna patternframe having the antenna pattern portion so that the antenna patternportion is embedded between the case frame and the radiator frame.

According to another aspect of the present invention, there is provideda method of manufacturing an electronic device case, the methodincluding: providing a radiator having an antenna pattern portiontransmitting and receiving a signal, a connection terminal portionmaking contact with a circuit board of an electronic device, and aconnection portion connecting the antenna pattern portion and theconnection terminal portion to be arranged in different planes;arranging the radiator in a space inside an upper or lower mold formanufacturing a radiator frame and injecting a resin material therein toform the radiator frame having the antenna pattern portion formed on oneside thereof; and forming the radiator frame integrally with a caseframe so that the radiator is embedded between the radiator frame andthe case frame.

The case frame may be a separate injection molded part having a radiatorreceiving recess having a shape corresponding to the radiator frame, andthe radiator frame may be bonded to the radiator receiving recess.

The double injection molding may be performed by arranging the radiatorframe in a mold for manufacturing an electronic device case having aspace corresponding to the case frame, and injecting a resin materialinto the space.

The radiator frame may be manufactured by injection molding while theantenna pattern portion is arranged in contact with one surface of oneof the upper and lower molds, and the connection terminal portion may bearranged in contact with one surface of the other mold.

The injection molding may be performed while the connection terminalportion is arranged in a radiator support portion forming recessprovided in the upper or lower mold for manufacturing the radiator frameso that the connection terminal portion is supported by a radiatorsupport portion on the other side of the radiator frame.

The injection molding may be performed while the connection terminalportion is arranged in a radiator support portion forming recessprovided in the upper or lower mold for manufacturing the radiator frameso that the connection portion is formed through the radiator supportportion on the other side of the radiator frame.

The radiator frame, the case frame, or the radiator frame and the caseframe may have a curved portion so that the radiator has a curvature.

According to another aspect of the present invention, there is provideda mold for manufacturing an electronic device case, the mold including:an upper or lower mold for manufacturing an electronic device casereceiving a radiator frame manufactured by injection molding on aradiator having an antenna pattern portion transmitting and receiving asignal, a connection terminal portion making contact with a circuitboard of the electronic device, and a connection portion connecting theantenna pattern portion and the connection terminal portion to bearranged in different planes; and a resin material injection portionprovided through the upper mold, the lower mold, or the upper and lowermolds, the resin material injection portion through which a resinmaterial is injected into a space created between the upper and lowermolds so that the resin material filling the space therebetween forms acase of the electronic device when the upper and lower molds are joined.

A guide pin, a contact pin or a guide pin and a contact pin may beprovided in the upper or lower mold for manufacturing the electronicdevice case and be injected into or make contact with a guide pin hole,a contact pin hole or a guide pin hole and a contact pin hole providedin the radiator frame.

The space created between the upper and lower molds may have a shapecorresponding to a curved portion of the electronic device case.

According to another aspect of the present invention, there is provideda mobile communications terminal including: a radiator framemanufactured by injection molding with a radiator having an antennapattern portion, a connection terminal portion and a connection portionconnecting the antenna pattern portion and the connection terminalportion to be arranged in different planes, so that the antenna patternportion is provided on one side of the radiator frame and the connectionterminal portion is provided on the other side thereof; a case framecovering the one side of the radiator frame on which the antenna frameis provided so that the antenna pattern portion is embedded between thecase frame and the radiator frame; and a circuit board connected to theconnection terminal portion and transmitting and receiving a signal ofthe radiator.

The case frame may be an injection molded part and have a recesscorresponding to the one side of the radiator frame.

The case frame may be manufactured using injection molding on theradiator frame.

The radiator may be bent to provide the antenna pattern portion, theconnection terminal portion, and the connection portion connectedtherebetween.

The connection terminal portion may be supported by a radiator supportportion on the other side of the radiator frame.

The connection terminal portion may be formed through the radiatorsupport portion on the other side of the radiator frame.

The radiator frame, the case frame, or the radiator frame and the caseframe may have a curved portion so that the radiator has a curvature.

According to another aspect of the present invention, there is provideda mobile communications terminal including: a radiator having an antennapattern portion transmitting and receiving a signal; a connectionterminal separated from the antenna pattern portion and having aconnection terminal portion allowing the signal of the antenna patternportion to be transmitted to and received from a circuit board of anelectronic device; an antenna pattern frame manufactured by injectionmolding so that the antenna pattern portion is provided on one side ofthe antenna pattern frame, the connection terminal portion is providedon the other side thereof, and the radiator makes contact with theconnection terminal; and a case frame covering the one side of theantenna pattern frame on which the antenna pattern portion is providedso that the antenna pattern portion is embedded between the case frameand the antenna pattern frame.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic perspective view, with a cut-out portion, a caseof a mobile communications terminal, which is an electronic device,according to an exemplary embodiment of the present invention;

FIG. 2 is a schematic perspective view illustrating an antenna patternframe according to a first embodiment of the present invention;

FIG. 3 is a rear perspective view illustrating the antenna pattern frameof FIG. 2;

FIG. 4 is a cross-sectional view taken along the line A-A of FIGS. 2 and3;

FIG. 5 is a schematic sectional view illustrating an antenna patternframe according to a second embodiment of the present invention;

FIG. 6 is a schematic sectional view illustrating an antenna patternframe according to a third embodiment of the present invention;

FIG. 7 is a schematic sectional view illustrating an antenna patternframe according to a fourth embodiment of the present invention;

FIG. 8 is a schematic perspective view illustrating a radiator that isused to manufacture an antenna pattern frame according to an exemplaryembodiment of the present invention;

FIG. 9 is a schematic sectional view illustrating a first embodiment ofa mold for manufacturing an antenna pattern frame in order to illustratea method of manufacturing an antenna pattern frame according to anexemplary embodiment of the present invention;

FIG. 10 is a schematic view illustrating how a resin material isinjected into the mold of FIG. 9;

FIG. 11 is a schematic sectional view illustrating a second embodimentof a mold for manufacturing an antenna pattern frame in order toillustrate a method of manufacturing an antenna pattern frame accordingto an exemplary embodiment of the present invention;

FIG. 12 is a schematic view illustrating how a resin material isinjected into the mold of FIG. 11;

FIG. 13 is a schematic sectional view illustrating a third embodiment ofa mold for manufacturing an antenna pattern frame in order to illustratea method of manufacturing an antenna pattern frame according to anexemplary embodiment of the present invention;

FIG. 14 is a schematic view illustrating how a resin material isinjected into the mold of FIG. 13;

FIGS. 15A through 15D are schematic perspective views illustrating theshape of an antenna radiator that is used to fix a radiator having anantenna pattern to an antenna pattern frame according to an exemplaryembodiment of the present invention;

FIG. 16 is an exploded perspective view illustrating a case of a mobilecommunications terminal that is an electronic device having an antennapattern radiator is embedded therein according to an exemplaryembodiment of the present invention;

FIG. 17 is a schematic view illustrating a first embodiment of a methodof manufacturing an electronic device case having an antenna patternradiator embedded therein according to an exemplary embodiment of thepresent invention;

FIG. 18 is a schematic view illustrating a mold for manufacturing anelectronic device case that is used to perform a second embodiment of amethod of manufacturing an electronic device case having an antennapattern radiator embedded therein according to an exemplary embodimentof the present invention;

FIG. 19 is a schematic view illustrating how a resin material isinjected into the mold of FIG. 18;

FIG. 20 is a schematic perspective view illustrating an antenna patternradiator having a ground portion according to another exemplaryembodiment of the present invention;

FIG. 21 is a schematic perspective view illustrating an antenna patternradiator having a ground portion according to another exemplaryembodiment of the present invention;

FIG. 22 is a schematic sectional view illustrating a mold formanufacturing an antenna pattern frame that is used to perform a methodof manufacturing an antenna pattern frame having a ground portionaccording to another exemplary embodiment of the present invention; and

FIG. 23 is a schematic exploded perspective view illustrating a laptopcomputer that is an electronic device to which an antenna pattern framehaving a ground portion is applied according to another exemplaryembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Exemplary embodiments of the present invention will now be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. While thoseskilled in the art could readily devise many other varied embodimentsthat incorporate the teachings of the present invention through theaddition, modification or deletion of elements, such embodiments mayfall within the scope of the present invention.

FIG. 1 is a schematic perspective view illustrating, with a cut-outportion, a case of a mobile communications terminal that is anelectronic device according to an exemplary embodiment of the invention.FIG. 2 is a schematic perspective view illustrating an antenna patternframe according to a first embodiment of the invention. FIG. 3 is a rearperspective view illustrating the antenna pattern frame of FIG. 2. FIG.4 is a cross-sectional view taken along the line A-A of FIGS. 2 and 3.

Referring to FIGS. 1 through 4, a radiator 220 having an antenna patternformed thereon according to this embodiment is embedded in a case 120 ofa mobile communications terminal 100. In order that the radiator 220having the antenna pattern thereon is embedded in the case 120, anantenna pattern frame 200 needs to be provided so that the radiator 220having the antenna pattern thereon is formed on a radiator frame 210.

The antenna pattern frame 200, provided to form the antenna patterninside the electronic device case according to this embodiment, mayinclude the radiator 220 having an antenna pattern portion 222 andconnection terminal portions 224, and the radiator frame 210.

The radiator 220 may be formed of a conductive material, such asaluminum or copper. Further, the radiator 220 may receive externalsignals and transmit the received external signals to a signal processorof the electronic device such as the mobile communications terminal 100.Further, the radiator 220 includes the antenna pattern portion 222 whichis a meander line antenna pattern.

The connection terminal portions 224 transmit the received externalsignals to the electronic device. The connection terminal portions 224may be formed by bending, forming or drawing a portion of the radiator220. Alternatively, the connection terminal portions 224 may bemanufactured separately from the radiator 220 and be then connected tothe radiator 220 (see FIG. 7).

The radiator frame 210 may have a three-dimensional structure consistingof a straight portion 260 having a flat profile and a curved portion 240with a curvature. The radiator 220 may have flexibility such that theradiator 220 can be disposed along the curved portion 240 of theradiator frame 210.

The radiator frame 210 is produced by injection molding. While theantenna pattern portion 222 may be formed on one side 210 a of theradiator frame 210, the connection terminal portions 224 may be formedon the other side 210 b opposite to the one side 210 a.

The radiator 220, which is embedded in the electronic device case 120,has the antenna pattern portion 222 receiving external signals and theconnection terminal portions 224 transmitting the received externalsignals to the electronic device that may be arranged in the differentplanes.

The one side 210 a of the radiator frame 210, on which the antennapattern portion 222 is formed, is bonded to the inside of the electronicdevice case 120, so that the antenna pattern can be embedded in theelectronic device case 120.

Alternatively, the antenna pattern may be embedded in the electronicdevice case 120 by placing the antenna pattern frame 200 in a mold andperforming insert molding.

Therefore, the antenna pattern frame 200 serves as a first injectionmolded part so that the radiator 220 having the antenna pattern portion222 thereon is placed within the electronic device case 120.

The radiator 220 and the radiator frame 210 may have the same boundary,which increases the fluidity of materials, such as resin, during asecond injection molding process in which the antenna pattern frame 200is placed within the mold after the first injection molding process.

Guide pin holes 225 may be formed in the radiator 220. Guide pins 328(see FIG. 9) of a mold 300 are inserted into the guide pin holes 225during molding to thereby prevent the movement of the radiator 220 onthe radiator frame 210.

Contact pinholes 223 may be formed in the radiator 220 so that contactpins 326 (see FIG. 9) of the mold 300 are inserted into the contact pinholes 223 during injection molding, thereby preventing the movement ofthe radiator 220 on the radiator frame 210.

The contact pins 326 and the guide pins 328 may be formed on theradiator 220. After injection molding is completed, portions of theradiator frame 210 located under the contact pins 326 are filled, whileholes are formed in portions of the radiator frame 210 located under theguide pins 328.

The contact pins 326 to be inserted into the contact pin holes 223,formed in the radiator 220, prevent the horizontal movement of theradiator 220 in the mold 300 during the first injection molding process.Furthermore, the guide pins 328 to be inserted into the guide pin holes225, formed in the radiator 220, prevent the vertical movement of theradiator 220 in the mold 300 during the first injection molding process.

Various embodiments of the antenna pattern frame 200 configured asdescribed above will now be described in detail.

[Antenna Pattern Frame According to First Embodiment]

FIGS. 2 through 4 are views illustrating an antenna pattern frameaccording to a first embodiment of the invention.

The radiator 220 of the antenna pattern frame 200 according to the firstembodiment may be bent to form the connection terminal portions 224, theantenna pattern portion 222, and connection portions 226 connectedtherebetween.

The connection portions 226 may connect the antenna pattern portion 222and the connection terminal portions 224 to be arranged in the differentplanes. The connection terminal portions 224 that are not embedded inthe electronic device case may be exposed on the other side 210 b of theantenna pattern frame 200.

That is, the radiator 220 is bent on the basis of the connectionportions 226 to form the antenna pattern portion 222 and the connectionterminal portions 224, so that the radiator 220 can be realized to havea three-dimensional curved surface.

In order to support the radiator 220 having the three-dimensional curvedsurface, radiator support portions 250 may protrude from the other side210 b of the radiator frame 210.

The radiator support portions 250 can firmly support the connectionportions 226 and the connection terminal portions 224 that are exposedon the other side 210 b.

[Antenna Pattern Frame According to Second Embodiment]

FIG. 5 is a schematic sectional view illustrating an antenna patternframe according to a second embodiment of the invention.

Referring to FIG. 5, similarly to the first embodiment, described withreference to FIGS. 2 through 4, the radiator 220 of the antenna patternframe 200 according to the second embodiment may be bent to form theconnection terminal portions 224 and the antenna pattern portion 222,and the connection portions 226 connected therebetween.

However, the connection portions 226 according to the second embodimentmay be formed through the radiator support portions 250 that protrudefrom the other side of the radiator frame 210.

[Antenna Pattern Frame According to Third Embodiment]

FIG. 6 is a view illustrating an antenna pattern frame according to athird embodiment of the invention.

Referring to FIG. 6, similarly to the above-described first and secondembodiments, the radiator 220 of the antenna pattern frame 200 may bebent to form the connection terminal portions 224 and the antennapattern portion 222, and the connection portions 226 connectedtherebetween.

The radiator frame 210 according to the third embodiment does not havethe radiator support portions 250 that protrude from the other side 210a of the antenna pattern frame 200. The bottom of the radiator supportportions 250 is at the same level as that of the radiator frame 210.Further, the connection portions 226 according to the third embodimentmay be formed through the radiator frame 210 or the radiator supportportions 250.

[Antenna Pattern Frame According to Fourth Embodiment]

FIG. 7 is a view illustrating an antenna pattern frame according to afourth embodiment of the invention.

Referring to FIG. 7, the antenna pattern frame 200 according to thefourth embodiment may include a connection terminal 270 that isseparated from the antenna pattern portion 222.

The connection terminal 270 may be an elastic body that connects theantenna pattern portion 222 and a circuit board 140 to each other.

In particular, the connection terminal 270 may be a C-clip or a pogo-pinthat allows for an electrical connection between the antenna patternportion 222 and the circuit board 140. A hole may be formed in theradiator frame 210 so that the connection terminal 270 can be insertedinto the hole.

Hereinafter, a method and mold for manufacturing the antenna patternframe 200 according to the above-described various embodiments will nowbe described in detail.

FIG. 8 is a schematic perspective view illustrating a radiator that isused to manufacture an antenna pattern frame according to an exemplaryembodiment of the invention. FIG. 9 is a schematic sectional viewillustrating a first embodiment of a mold for manufacturing an antennapattern frame in order to illustrate a method of manufacturing anantenna pattern frame according to an exemplary embodiment of theinvention. FIG. 10 is a schematic view illustrating how a resin materialis injected into the mold of in FIG. 9.

Hereinafter, a method of manufacturing the antenna pattern frame 200according to an exemplary embodiment of the invention will be describedwith reference to FIGS. 8 through 10.

First, as shown in FIG. 8, the radiator 220 has the antenna patternportion 222 and the connection terminal portions 224 that are arrangedin the different planes. The antenna pattern portion 222 receivesexternal signals. The connection terminal portions 224 are in contactwith the circuit board of the electronic device to thereby transmit thereceived external signals to the electronic device.

Both the guide pin holes 225 and the contact pin holes 223 may be formedin the radiator 220.

The radiator 220 may have a three-dimensional structure. Specifically,the radiator 220 is bent to form the antenna pattern portion 222 and theconnection terminal portions 224, and the connection terminal portions226 connected therebetween.

After the radiator 220 is provided, the radiator 220 is placed in aninner space 350 of the mold 300.

The inner space 350 is created when an upper mold 320 and a lower mold340 are joined. A recess, formed in the upper mold 320 or the lower mold340, becomes the inner space 350 when the upper mold 320 and the lowermold 340 are joined.

When the upper mold 320 and the lower mold 340 are joined, the guidepins 328, the contact pins 326, or the guide pins 328 and the contactpins 326, formed in the upper mold 320 or the lower mold 340, areinserted into or make contact with the guide pin holes 225, the contactpin holes 223, or the guide pinholes 225 and the contact pin holes 223,formed in the antenna pattern portion 222, so that the radiator 220 canbe fixed in the inner space 350.

A resin material is injected into the inner space 350 to form theradiator frame 210, so that the antenna pattern portion 222 is embeddedin the electronic device case 120.

Here, the inner space 350 of the upper or lower mold 320 or 340 iscurved so that the radiator frame 210 has a curved portion 240.

The resin material is injected so that the bottom of the radiator 220 isat the same level as that of the radiator frame 210. Therefore, when theradiator frame 210 is put in the mold for injection molding in order tomanufacture the electronic device case 120 in which the antenna patternis embedded, the flowability of the resin can be improved.

[Mold for Manufacturing Antenna Pattern Frame According to FirstEmbodiment]

Referring to FIGS. 9 and 10, the mold 300 for manufacturing the antennapattern frame 200 will be described in detail.

The mold 300 for manufacturing the electronic device case 120 having theantenna pattern portion 222 embedded therein according to an exemplaryembodiment of the invention may include the upper and lower molds 320and 340 and the resin material injection portion 370.

The radiator 220 may be received between the upper and lower molds 320and 340 while the antenna pattern portion 222 receiving an externalsignal and the connection terminal portions 224 in contact with thecircuit board 140 of the electronic device are arranged in the differentplanes.

The resin material injection portion 370 is a passage through which aresin material flows. The resin material injection portion may be formedin the upper mold 320, the lower mold 340 or the upper and lower molds320 and 340. When the upper and lower molds 320 and 340 are joined, theresin material is injected into the inner space 350 between the upperand lower molds 320 and 340 so that the resin material filling the innerspace 350 forms the radiator frame 210 that allows the antenna patternportion 222 to be placed within the electronic device case 120.

The guide pins 328, the contact pins 326 or the guide pins 328 and thecontact pins 326, formed on the radiator 220, may be injected into ormake contact with the guide pin holes 225, the contact pin holes 223 orthe guide pin holes 225 and the contact pin holes 223, formed in any oneof the upper mold 320, the lower mold 340 or the upper and lower molds320 and 340.

The inner space 350 between the upper and lower molds 320 and 340 mayhave a space allowing the radiator frame 210 to have the curved portion240.

Furthermore, the inner space 350 of the upper and lower molds 320 and340 may receive the connection terminal portions 224 and have radiatorsupport portion forming recesses 346 to thereby form the radiatorsupport portions 250 that support the connection terminal portions 224.

Further, compression pins 324 may be provided on the upper mold 320, thelower mold 340 or the upper and lower molds 320 and 340. The compressionpins 324 compress the connection terminal portions 224 arranged in theradiator support portion forming recesses 346 so that the connectionterminal portions 224 make contact with the radiator support portionforming recesses 346.

The compression pins 324 may prevent the resin material from flowingunder the connection terminal portions 224. If the connection terminalportions 224 are partially covered with the injection molding material,this may cause an unstable electrical connection. The compression pins324 can prevent this unstable electrical connection.

[Mold for Manufacturing Antenna Pattern Frame According to SecondEmbodiment]

FIG. 11 is a schematic sectional view illustrating a second embodimentof a mold for manufacturing an antenna pattern frame to illustrate amethod of manufacturing an antenna pattern frame according to anexemplary embodiment of the invention. FIG. 12 is a schematic viewillustrating how a resin material is injected into the mold of FIG. 11.

With reference to FIGS. 11 and 12, the antenna pattern frame mold 300according to the second embodiment is substantially the same as the moldfor manufacturing an antenna pattern frame according to the firstembodiment except as described herein below.

According to the second embodiment, at least one of the guide pins orcontact pins that prevent the movement of the radiator may be insertedinto the mold 300 due to the flow of the resin material into the mold.

These guide pins or contact pins may be defined as flow pins 345. Theflow pins 345, arranged in the inner space 350 of the mold 300, supportthe radiator 220 before a resin material is injected and may move fromthe inner space 350 toward the mold 300 as the injection moldingmaterial is injected.

The use of the flow pins 345 can minimize pin marks unlike other pinsfixed to the mold 300.

[Mold for Manufacturing Antenna Pattern Frame According to ThirdEmbodiment]

FIG. 13 is a schematic sectional view illustrating a third embodiment ofa mold for manufacturing an antenna pattern frame to illustrate a methodof manufacturing an antenna pattern frame according to an exemplaryembodiment of the invention. FIG. 14 is a schematic view illustratinghow a resin material is injected into the mold of FIG. 13.

Referring to FIGS. 13 and 14, like the second embodiment, the antennapattern frame mold 300 according to the third embodiment issubstantially the same as the antenna pattern frame mold according tothe first embodiment except as described herein below.

According to the third embodiment, magnets 380 may be formed in theradiator support portion forming recesses 346 in which the connectionterminal portions 224 are mounted.

Similarly to the compression pins 324, the magnets 380 can prevent theresin material from flowing under the connection terminal portions 224and prevent an unstable electrical connection caused when the connectionterminal portions 244 are partially covered with the injection moldingmaterial.

[Antenna Pattern Frame for Preventing Loosening of Radiator and Methodof Manufacturing the Same]

Hereinafter, an antenna frame including a radiator frame having anantenna pattern firmly fixed thereto, and a method of manufacturing anantenna frame preventing loosening by firmly fixing the antenna patternto the radiator frame will be described.

FIGS. 15A through 15D are schematic perspective views illustrating theshape of an antenna radiator that is used to perform a method of fixinga radiator having an antenna pattern formed thereon according to anexemplary embodiment to an antenna pattern frame.

With reference to FIGS. 15A through 15D, various embodiments of aradiator are described in which the radiator 220 having contact surfaceextensions 227 is fixed to the antenna pattern frame 200.

As for the antenna pattern frame 200 to which the radiator 220, shown inFIGS. 15A through 15D is applied, the radiator 220 having the contactsurface extensions 227 formed thereon may be replaced with the radiator220 of the antenna pattern frame 200, shown in FIGS. 2 through 7.

That is, the antenna pattern frame 200, shown in FIGS. 15A through 15D,may include the radiator 220, the radiator frame 210 and the contactsurface extensions 227.

As for the radiator 220 and the radiator frame 210 of FIGS. 15A through15D, the description of the radiator 220 and the radiator frame 210 withreference to FIGS. 2 through 4 may be repeated.

However, the radiator 220 having the contact surface extensions 227prevents the loosening of the radiator 220 from the radiator frame 210when injection molding is performed to manufacture the radiator frame210.

When a resin material is fed into the mold in which the radiator 220 isplaced for injection molding, the contact surface extensions 227 canincrease the contact area with the resin material, so that the radiator220 can be firmly fixed to the radiator frame 210.

As shown in FIG. 15A, the contact surface extensions 227 may be blades227 a that extend from the edges of the radiator 220, are bent, and areinserted into the radiator frame 210.

Furthermore, as shown in FIG. 15B, the contact surface extensions 227may be holes 227 b that are formed in the radiator 220. An injectionmolding material flows through the holes 227 b to thereby increase thecontact surface and fix the radiator 220 in an accurate position.

As shown in FIG. 15C, the contact surface extensions 227 may be embossedinto the radiator 220 to thereby increase the contact area between theradiator 220 and the injection molding material and determine theaccurate position.

As shown in FIG. 15D, the contact surface extension 227 may be formed bybending the edges of the end of the antenna pattern portion 222 of theradiator 220 downward, and the bent contact extension 227 may beinserted into the radiator frame 210.

The antenna pattern frame 200 according to an exemplary embodiment ofthe invention that prevents the loosening of the radiator 220 can beapplied to the antenna pattern frame as described with reference toFIGS. 2 through 7.

As for the method of manufacturing an antenna frame that can preventloosening by firmly fixing the antenna pattern to the radiator frame210, the description of the injection molding methods with reference toFIGS. 8 through 14 may be repeated except that the radiator 220 havingthe contact surface extensions 227 formed to increase the contact areawith the molding injection material is put into the mold 30 duringinjection molding.

[Electronic Device Case Having Antenna Pattern Radiator EmbeddedTherein, Method and Mold for Manufacturing the Same, and MobileCommunications Terminal]

FIG. 16 is an exploded perspective view illustrating a case of a mobilecommunications terminal that is an electronic device having an antennapattern radiator embedded therein according to an exemplary embodimentof the invention.

Referring to FIG. 16, the electronic device case 120 having the antennapattern radiator 220 embedded therein according to this embodimentincludes the radiator 220, the radiator frame 210 and a case frame 130.

The descriptions of the embodiments, shown in FIGS. 2 through 7, willsubstitute for a description of the radiator 220 and the radiator frame210.

The case frame 130 covers one side of the radiator frame 210 having theantenna pattern portion 222 formed thereon, so that the antenna patternportion 222 is embedded between the radiator frame 210 and the caseframe 130.

The radiator frame 210 and the case frame 130 are formed integrally witheach other. As viewed from bottom of the electronic device case 120, theantenna pattern portion 222 may not been seen but the connectionterminal portions 224 may be seen.

The radiator frame 210, the case frame 130, or the radiator frame 210and the case frame 130 may be manufactured using injection molding.Particularly, the radiator frame 210 and the case frame 130 aremanufactured as different injection molded parts, the radiator frame 210having the radiator 220 formed thereon is bonded to the case frame 130.

The case frame 130 may be formed by using injection molding on theradiator frame 210, thereby performing double injection molding. Thatis, the radiator frame 210 is put into the mold, and insert injectionmolding is performed, so that the radiator frame 210 and the case frame130 can be formed integrally with each other.

When put into a mold 500 for manufacturing the electronic device case,guide pins or contact pins (not shown), formed on the mold 500, may beinserted into the guide pin holes 225 or the contact pin holes 223,formed in the radiator frame 210, thereby preventing the movement of theantenna pattern frame 200 inside the mold 500.

Hereinafter, a method of manufacturing an electronic device case will bedescribed in detail with reference to FIGS. 16 through 19.

According to the method of manufacturing an electronic device caseaccording to an exemplary embodiment of the invention, the radiator 220is provided in which the antenna pattern portion 222 receiving anexternal signal and the connection terminal portions 224 making contactwith the connection terminals 144 of the circuit board 140 of theelectronic device are arranged in the different planes.

The radiator 220 is placed in the inner space 350 of the upper mold 300or the lower mold 350 to manufacture the radiator frame 210, and a resinmaterial is fed into the upper and lower molds, thereby manufacturingthe radiator frame 210 having the radiator 220 formed on one side of theradiator frame 210.

Furthermore, in order that the radiator 220 is embedded between theradiator frame 210 and the case frame 130, the radiator frame 210 andthe case frame 130 are formed integrally with each other to manufacturethe electronic device case 120 in which the antenna is embedded.

FIG. 17 is a schematic view illustrating a first embodiment of a methodof manufacturing an electronic device case having an antenna patternradiator embedded therein according an exemplary embodiment of theinvention.

Referring to FIG. 17, the case frame 130 is a separate injection moldedpart that includes a radiator receiving recess 122 having a shapecorresponding to that of the radiator frame 210. By bonding the radiatorframe 210 to the radiator receiving recess 122, the electronic devicecase 120 having the antenna pattern radiator embedded therein can bemanufactured.

An adhesive layer 410 is formed on the surface of the radiator 220 ofthe antenna pattern frame 200.

FIG. 18 is a schematic view illustrating a mold for manufacturing anelectronic device case that is used to perform a second embodiment of amethod of manufacturing an electronic device case having an antennapattern radiator embedded therein according to an exemplary embodimentof the invention. FIG. 19 is a schematic view illustrating how a resinmaterial is injected into the mold of FIG. 18.

Referring to FIGS. 18 and 19, the electronic device case 120 having theantenna pattern radiator 220 embedded therein is manufactured in such away that the radiator frame 210 is arranged in the mold 500 formanufacturing an electronic device case that has the inner space 550having a shape corresponding to the case frame, and the resin materialis fed into the mold 550, thereby forming radiator frame 210 integrallywith the electronic device case 120.

That is, the radiator frame 210 and the case frame 130 may be formedintegrally with each other.

Here, injection molding for manufacturing the antenna pattern frame 200is referred to as a first injection molding process, and injectionmolding for manufacturing the electronic device case 120 is referred toas a second injection molding process. Like the first injection moldingprocess, the movement of the antenna pattern frame 200 inside the mold500 can be prevented during the second injection molding process.

Furthermore, the inner space 550 of the mold 500 may include a curvegeneration portion 524 that allows the electronic device case 120 to becurved.

The mold of the electronic device case for manufacturing the electronicdevice case 120 having the antenna pattern embedded therein during thesecond injection molding process may include the upper or lower mold 520or 540 and a resin material injection portion 570. The upper or lowermold 520 and 540 receives the radiator frame 210 including the radiator220 having the antenna pattern portion 222 receiving an external signaland the connection terminal portions 224 making contact with the circuitboard of the electronic device while the antenna pattern portion 222 andthe connection terminal portions 224 are formed in the different planes.The resin material injection portion 570 is formed in the upper mold520, the lower mold 540, or the upper and lower molds 520 and 540. Aresin material flows through the resin material injection portion 570into the inner space 550 created when the upper and lower molds 520 and540 are joined, so that the resin material filling the inner space 550forms the electronic device case 120.

Like the radiator 220, guide pin holes or contact pin holes are formedin the radiator frame 210. The guide pins or the contact pins, formed inthe mold 500, may be inserted into these guide pin holes or contact pinholes, so that the movement of the radiator frame 210 inside the mold500 can be prevented.

The electronic device case having the antenna pattern embedded thereincan be applied to the mobile communications terminal 100.

That is, the mobile communications terminal 100, that is, an electronicdevice having an antenna pattern embedded therein according to anexemplary embodiment of the invention may include the radiator frame210, the case frame 130 and the circuit board 140.

As for the radiator frame 210 and the case frame 130, all of theabove-described embodiments and the manufacturing methods thereof can beapplied.

Thus, the above description will substitute for a detailed descriptionof the mobile communications terminal 100.

[Electronic Device to which Antenna Pattern Frame Having a GroundPortion is Applied]

FIG. 20 is a schematic perspective view illustrating an antenna patternframe having a ground portion according to another exemplary embodimentof the invention. FIG. 21 is a schematic view illustrating an antennapattern radiator having a ground portion according to another exemplaryembodiment of the invention.

An antenna pattern frame 600 having a ground portion according toanother exemplary embodiment of the invention may be widely used for alaptop computer requiring noise reduction among electronic deviceshaving antenna patterns embedded in a case.

The antenna pattern frame 600 having a ground portion according toanother exemplary embodiment of the invention may include a radiator620, a ground portion 626 and a radiator frame 610.

The antenna pattern frame 600 according to this embodiment is differentfrom the antenna pattern frame 200, shown in FIGS. 2 through 7, in thatthe ground portion 626 extends from the radiator 620. The radiator frame610 may be modified in order to form the ground portion 626.

The ground portion 626 may be supported by a ground portion support 612that is stepped with respect to the radiator frame 610.

The antenna pattern portion 622 may be formed on one side 610 a of theradiator frame 610 or connection terminal portions 624 may be formed onthe other side 610 b opposite to the one side 610 a.

The radiator frame 610 may be configured so that the antenna patternportion 622 is embedded in the electronic device case.

Like the antenna pattern frame 200, shown in FIGS. 2 through 7, theradiator 620 of the antenna pattern frame 600 may include the connectionterminal portions 624 that are formed on the other side 610 b of theradiator frame 610 so as to transmit the external signal to the circuitboard.

Furthermore, the radiator 620 is bent to form connection portions 628,which are then bent to form the ground portion 626. The ground portions626 may be formed through the radiator frame 610. As the connectionportions 628 are formed through the radiator frame 610, the radiator 620can be firmly fixed to the radiator frame 610.

Further, contact pin holes 623 that prevent the movement of the radiator620 inside a mold 700 may be formed in the radiator 620.

Contact pins 728 of the mold 700 may be inserted into the contact pinholes 623 during injection molding to thereby prevent the movement ofthe radiator 620 inside the mold 700.

Guide pin holes 625 may be formed in the radiator 620. Guide pins 726 ofthe mold 700 may be inserted into the guide pin holes 625 duringinjection molding to thereby prevent the movement of the radiator 620inside the mold 700.

FIG. 22 is a schematic sectional view illustrating a mold formanufacturing an antenna pattern frame that is used to perform a methodof manufacturing an antenna pattern frame having a ground portionaccording to another exemplary embodiment.

According to the method of manufacturing an antenna pattern frame havinga ground portion according to another exemplary embodiment of theinvention, first, the radiator 620 may be provided in which the antennapattern portion 622 receiving the external signal and the ground portion626 may be arranged in the different planes.

The radiator 620 may be placed in the mold 700 that has an inner space750 receiving the radiator 620.

After the radiator 620 is arranged in the mold 700, a resin material isinjected into the inner space 750 through the resin material injectionportion 770, formed in the mold 700, so that the resin material fillingthe inner space 750 forms the radiator frame 610 that allows theradiator 620 to be embedded in the electronic device case.

When the radiator 620 is arranged in the mold 700, the guide pins 726,the contact pins 728 or the guide pins 726 and the contact pins 728formed on the mold 700 may be injected into or make contact with theguide pin holes 625, the contact pin holes 623, or the guide pin holes625 and the contact pin holes 623 formed in the radiator 620.

Recesses may be formed in the inner space 750 so as to receive theconnection terminal portions 624 therein. Injection molding may beperformed by arranging the connection terminal portions 624 in therecesses.

The mold 700 for manufacturing the antenna pattern frame having theground portion according to another exemplary embodiment of theinvention may include an upper mold 720 or a lower mold 740 and theresin material injection portion 770. The upper or lower molds 720 or740 receives the radiator 620 having the antenna pattern portion 622receiving an external signal and the ground portion 626 while theantenna pattern portion 622 and the ground portion 626 are arranged inthe different planes. The resin material injection portion 770 is formedin the upper mold 720, the lower mold 740, or the upper and lower molds720 and 740. A resin material is injected into the inner space 750through the resin material injection portion 770 so that the resinmaterial filling the inner space 750 forms the antenna pattern frame 600that allows the radiator 620 to be embedded in the electronic devicecase.

Furthermore, the guide pins 726, the contact pins 728 or the guide pins726 and the contact pins 728 may be formed in the upper or lower mold720 or 740 and be inserted into the guide pine holes 625, the contactpin holes 623, or the guide pin holes 625 and the contact pin holes 623formed in the radiator frame 610.

The connection terminal portions 624 may be received in the upper mold720, the lower mold 740, or the upper and lower molds 720 and 740.

FIG. 23 is a schematic exploded perspective view illustrating a laptopcomputer that is an electronic device to which an antenna pattern framehaving a ground portion according to another exemplary embodiment to theinvention is applied.

As for the radiator frame 610 having the antenna pattern portion 622,the connection terminal portions 624, and the ground portion 626, theantenna pattern portion 622 may be embedded in a case of a laptopcomputer, which is an electronic device 800.

That is, the electronic device 800 according to this embodiment mayinclude the radiator frame 610, a case 820 and a circuit board 600.

As for the radiator frame 610, all of the above-described embodimentsand manufacturing methods thereof may be applied.

Therefore, the above description will substitute for a detaileddescription of the electronic device 800.

As set forth above, according to an antenna pattern frame and a methodand mold for manufacturing the same according to an exemplary embodimentof the invention, a radiator having an antenna pattern portion can beembedded in an electronic device case, thereby reducing thevulnerability of an external antenna according to the related art toexternal shocks and preventing an increase in the volume of an internalantenna.

Furthermore, since an antenna of flexible materials can be embedded inthe electronic device case, the durability and performance of theantenna can be improved in comparison with the use of the adhesive.

Furthermore, since the antenna can be embedded in the electronic devicecase without using a protective film, the case can be formed into athree-dimensional shape, such as a curved surface, thereby diversifyingthe appearance thereof.

Moreover, since an antenna film is not used, a manufacturing process canbe performed with ease, and manufacturing costs can be reduced.

In addition, since the radiator and the connection terminal portions canbe firmly supported against the antenna pattern frame, the loosening ofthe antenna pattern portion from a frame can be prevented, and theantenna pattern portion can be firmly connected to the circuit board ofthe electronic device.

Furthermore, since this antenna pattern frame can be applied to any kindof electronic devices requiring antennas, various applications of theantenna pattern frame can be made.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

1. An electronic device case having an antenna pattern embedded therein,the electronic case comprising: a radiator having an antenna patternportion transmitting and receiving a signal and a connection terminalportion allowing the signal to be transmitted to and received from acircuit board of an electronic device; a connection portion partiallyforming the radiator and connecting the antenna pattern portion and theconnection terminal portion to be arranged in different planes; aradiator frame manufactured by injection molding on the radiator so thatthe antenna pattern portion of the radiator is provided on one side ofthe radiator frame and the connection terminal portion is provided onthe other side thereof; and a case frame covering the one side of theradiator frame on which the antenna pattern portion is provided so thatthe antenna pattern portion is embedded between the case frame and theradiator frame.
 2. The electronic device case of claim 1, wherein thecase frame is an injection molded part and has a recess corresponding tothe one side of the radiator frame.
 3. The electronic device case ofclaim 1, wherein the case frame is manufactured using injection moldingon the radiator frame.
 4. The electronic device case of claim 1, whereinthe radiator is bent to provide the connection terminal portion, theantenna pattern portion, and the connection portion connectedtherebetween.
 5. The electronic device case of claim 1, wherein theconnection terminal portion is supported by a radiator support portionon the other side of the radiator frame.
 6. The electronic device caseof claim 1, wherein the connection terminal portion is provided throughthe radiator support portion on the other side of the radiator frame. 7.The electronic device case of claim 1, wherein the radiator frame, thecase frame, or the radiator frame and the case frame have a curvedportion so that the radiator has a curvature.
 8. An electronic devicecase having an antenna pattern embedded therein, the electronic casecomprising: a radiator having an antenna pattern portion transmittingand receiving a signal; a connection terminal separated from the antennapattern portion and having a connection terminal portion allowing thesignal of the antenna pattern portion to be transmitted to or receivedfrom a circuit board of an electronic device; an antenna pattern framemanufactured by injection molding so that the antenna pattern portion isprovided on one side of the antenna pattern portion, the connectionterminal portion is provided on the other side thereof, and the radiatormakes contact with the connection terminal; and a case frame coveringthe one side of the antenna pattern frame having the antenna patternportion so that the antenna pattern portion is embedded between the caseframe and the radiator frame.
 9. A method of manufacturing an electronicdevice case, the method comprising: providing a radiator having anantenna pattern portion transmitting and receiving a signal, aconnection terminal portion making contact with a circuit board of anelectronic device, and a connection portion connecting the antennapattern portion and the connection terminal portion to be arranged indifferent planes; arranging the radiator in a space inside an upper orlower mold for manufacturing a radiator frame and injecting a resinmaterial therein to form the radiator frame having the antenna patternportion formed on one side thereof; and forming the radiator frameintegrally with a case frame so that the radiator is embedded betweenthe radiator frame and the case frame.
 10. The method of claim 9,wherein the case frame is a separate injection molded part having aradiator receiving recess having a shape corresponding to the radiatorframe, and the radiator frame is bonded to the radiator receivingrecess.
 11. The method of claim 9, wherein double injection molding isperformed by arranging the radiator frame in a mold for manufacturing anelectronic device case having a space corresponding to the case frame,and injecting a resin material into the space.
 12. The method of claim9, wherein the radiator frame is manufactured by injection molding whilethe antenna pattern portion is arranged in contact with one surface ofone of the upper and lower molds, and the connection terminal portion isarranged in contact with one surface of the other mold.
 13. The methodof claim 9, wherein injection molding is performed while the connectionterminal portion is arranged in a radiator support portion formingrecess provided in the upper or lower mold for manufacturing theradiator frame so that the connection terminal portion is supported by aradiator support portion on the other side of the radiator frame. 14.The method of claim 9, wherein injection molding is performed while theconnection terminal portion is arranged in a radiator support portionforming recess provided in the upper or lower mold for manufacturing theradiator frame so that the connection portion is formed through theradiator support portion on the other side of the radiator frame. 15.The method of claim 9, wherein the radiator frame, the case frame, orthe radiator frame and the case frame have a curved portion so that theradiator has a curvature.
 16. A mold for manufacturing an electronicdevice case, the mold comprising: an upper or lower mold formanufacturing an electronic device case receiving a radiator framemanufactured by injection molding on a radiator having an antennapattern portion transmitting and receiving a signal, a connectionterminal portion making contact with a circuit board of the electronicdevice, and a connection portion connecting the antenna pattern portionand the connection terminal portion to be arranged in different planes;and a resin material injection portion provided through the upper mold,the lower mold, or the upper and lower molds, the resin materialinjection portion through which a resin material is injected into aspace created between the upper and lower molds so that the resinmaterial filling the space therebetween forms a case of the electronicdevice when the upper and lower molds are joined.
 17. The mold of claim16, wherein a guide pin, a contact pin or a guide pin and a contact pinare provided in the upper or lower mold for manufacturing the electronicdevice case and are injected into or make contact with a guide pin hole,a contact pin hole or a guide pin hole and a contact pin hole providedin the radiator frame.
 18. The mold of claim 16, wherein the spacecreated between the upper and lower molds has a shape corresponding to acurved portion of the electronic device case.
 19. A mobilecommunications terminal comprising: a radiator frame manufactured byinjection molding on a radiator having an antenna pattern portion, aconnection terminal portion and a connection portion connecting theantenna pattern portion and the connection terminal portion to bearranged in different planes, so that the antenna pattern portion isprovided on one side of the radiator frame and the connection terminalportion is provided on the other side thereof; a case frame covering theone side of the radiator frame on which the antenna frame is provided sothat the antenna pattern portion is embedded between the case frame andthe radiator frame; and a circuit board connected to the connectionterminal portion and transmitting and receiving a signal of theradiator.
 20. The mobile communications terminal of claim 19, whereinthe case frame is an injection molded part and has a recesscorresponding to the one side of the radiator frame.
 21. The mobilecommunications terminal of claim 19, wherein the case frame ismanufactured using injection molding on the radiator frame.
 22. Themobile communications terminal of claim 19, wherein the radiator is bentto provide the antenna pattern portion, the connection terminal portion,and the connection portion connected therebetween.
 23. The mobilecommunications terminal of claim 19, wherein the connection terminalportion is supported by a radiator support portion on the other side ofthe radiator frame.
 24. The mobile communications terminal of claim 19,wherein the connection terminal portion is formed through the radiatorsupport portion on the other side of the radiator frame.
 25. The mobilecommunications terminal of claim 19, wherein the radiator frame, thecase frame, or the radiator frame and the case frame have a curvedportion so that the radiator has a curvature.
 26. A mobilecommunications terminal comprising: a radiator having an antenna patternportion transmitting and receiving a signal; a connection terminalseparated from the antenna pattern portion and having a connectionterminal portion allowing the signal of the antenna pattern portion tobe transmitted to and received from a circuit board of an electronicdevice; an antenna pattern frame manufactured by injection molding sothat the antenna pattern portion is provided on one side of the antennapattern frame, the connection terminal portion is provided on the otherside thereof, and the radiator makes contact with the connectionterminal; and a case frame covering the one side of the antenna patternframe on which the antenna pattern portion is provided so that theantenna pattern portion is embedded between the case frame and theantenna pattern frame.